Fraunhofer at the embedded world 2023

Nürnberg / March 14, 2023 - March 16, 2023

embedded world 2023

Trade fair for embedded systems

Hall 4, booth 422

intelligent. efficient. sustainable

At the embedded world Exhibition&Conference from March 14 to 16, 2023, Fraunhofer institutes will present their developments in the fields of edge AI, sustainable systems, and sensor and system design in Hall 4, Booth 422.

Participating institutes

Fraunhofer Institute for Integrated Circuits IIS | Fraunhofer Institute for Reliability and Microintegration IZM | Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP | Fraunhofer Institute for Microelectronic Circuits and Systems IMS

Energy-autonomous IoT sensors

In Energy Harvesting, the Fraunhofer IIS develops technologies and systems for using energy from the environment to power small electronic consumers. The latest development is a so-called NarrowBand IoT module that collects and transmits utility data in a 5G network. To ensure that the modules and sensors can be operated energy independently, they were specially measured and optimized for energy consumption.

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Tiny Machine Learning (TinyML)

Fraunhofer IIS has taken another step in the field of artificial intelligence by creating a new technology for small embedded systems with its new "TinyML". This method makes it possible to run applications energy-efficiently and independently of a cloud server. Its advantages enable companies to deploy artificial intelligence in the smallest possible space. embeddif.[ai] represents a product portfolio developed by Fraunhofer IIS.

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Spiking Neural Networks: a energy efficient neuromorphic hardware design

With Spiking Neural Networks (SNNs), Fraunhofer IIS is researching a novel neuromorphic hardware design for ultra-low-power applications. Inspired by the human brain, artificial neurons transmit and process relevant data in the form of pulses.

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Neuromorphic hardware

Current neural network architectures like deep neural networks require high computational complexity and power consumption. Neuromorphic hardware in contrast relies on massive parallel processing and performs calculations, e.g. for Machine Learning, faster and with less power.

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IC Design: Analog, RF, digital and mixed-signal circuits

As one of the leading IC design facilities in Europe, we develop customized solutions to meet the constantly evolving requirements of industrial applications. Our focus is on development of mixed-signal ASICs, intelligent integrated sensor systems as well as on design solutions for increasingly complex electronic systems.

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RFicient® - Ultra-low power wake-up receiver

The energy-efficient RFicient® radio receiver technology with a current consumption less than 3 µA can receive radio telegrams in three license-free frequency bands simultaneously and independently of each other. This makes positioning systems for the localization of objects in warehouses possible, but also worldwide mobile applications, such as container tracking without manual frequency switching.

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Deep SiL testing of embedded HW/SW systems

Deep SiL testing of embedded systems enables an agile development process as used by the SW industry for years. By using virtual hardware models, deep software testing can start way before hardware is available. This allows to deep test your system from the application layer down to the hardware withouth modifying your software which will increase the coverage significantly and produce more robust systems.

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Modern system packaging solutions

New Innovative concepts are fundamental in order to meet the challenges for electronic systems owing to extended functionality and increasing miniaturization. Recent packaging-solutions not only have minimal space requirements but also allow a high data throughput with low energy-consumption. Fraunhofer IIS/EAS supports to master the complex design of packaging-solutions, exploiting degrees of freedom while considering the thermal, mechanical and electrical coupling.

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Functional safety

Damage detection is about detecting damage before it causes the component to fail. In our case, the method of thermal spectroscopy is used. By measuring the transient thermal resistance, damage in the package of an integrated circuit or discrete electronic components can be detected before a functional failure occurs. It is then possible to react, i.e. repair or replace the component and thus prevent its failure.

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Plug & Play platforms for wireless sensor technology and radar sensor technology

Fraunhofer IZM has developed two plug & play platforms, designed to quickly test and validate concepts for wireless and radar sensor technology. This removes the need for a separate and time-consuming configuration of the sensor and data processing technology, because both kits come with uniform interfaces and a configuration process, modules, and assemblies designed according to the Lego principle.

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Energy consulting for miniaturized systems

With the increasing miniaturization of distributed electronic systems, the right power supply is becoming a challenging issue. There are many options for designing the optimum energy management system and minimizing power consumption. The RF & Smart Sensor Systems department at Fraunhofer IZM is a reliable partner for energy consulting for miniaturized systems.

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IIoT wireless sensor platform

Whatever infrastructure is already in place, the "Swarmy" sensor-actuator platform enables the configuration of modular sensor setups for a variety of common variables, including the means to collect, process, and display data. By integrating swarm robotics, the "Swarmy-V2" platform is set to become even smarter.

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Ultra-low power OLED microdisplays – ready for industrial transfer

The Fraunhofer FEP works on innovative solutions in the fields of vacuum coating, surface treatment as well as organic semiconductors. The core competences electron beam technology, plasma-assisted large-area and precision coating, roll-to-roll technologies, development of technological key components as well as technologies for the organic electronics and IC/system design provide a basis for these activities.

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Manifold microelectronics in four business units

Fraunhofer IMS provides numerous technologies in the four business units Health, Industry, Mobility, and Space & Security. We create customized solutions for your applications in the field of biomedical sensor technology, optical sensors, such as LiDAR detectors, RISC-V processors and open hardware architectures, AI software frameworks or even quantum technology.

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Contact

Contact Press / Media

Angela Raguse M.A.

Corporate communications location nuremberg

Fraunhofer Institute for Integrated Circuits IIS
Nordostpark 84
90411 Nürnberg, Germany

Phone +49 9131 776 5105

Send email
angela.raguse@iis.fraunhofer.de
www.iis.fraunhofer.de

Contact Press / Media

Susanne Pichotta

Events and trade fairs

Fraunhofer-Gesellschaft
Hansastrasse 27c
80686 Munich, Germany

Phone +49 89 1205-1377

Fax +49 89 1205-7513

Send email
susanne.pichotta@zv.fraunhofer.de

Fraunhofer at the embedded world 2023

Nürnberg / March 14, 2023 - March 16, 2023

embedded world 2023

intelligent. efficient. sustainable

Brochure

WeKnowIoT

intelligent – energy-efficient – sustainable

Participating institutes

Energy-autonomous IoT sensors

Tiny Machine Learning (TinyML)

Spiking Neural Networks: a energy efficient neuromorphic hardware design

Neuromorphic hardware

IC Design: Analog, RF, digital and mixed-signal circuits

RFicient® - Ultra-low power wake-up receiver

Deep SiL testing of embedded HW/SW systems

Modern system packaging solutions

Functional safety

Plug & Play platforms for wireless sensor technology and radar sensor technology

Energy consulting for miniaturized systems

IIoT wireless sensor platform

Ultra-low power OLED microdisplays – ready for industrial transfer

Manifold microelectronics in four business units

Contact Press / Media

Angela Raguse M.A.

Contact Press / Media

Susanne Pichotta