Fraunhofer at the
electronica

November 12 − 15, 2024 in Munich, Germany

Trade fair

Munich / November 12, 2024 - November 15, 2024

Fraunhofer at the electronica 2024

World’s leading trade fair and conference for electronics

https://electronica.de

You will find our joint stand in: Hall B4 / Stand 141

The electronica is the world's leading trade fair and largest innovation platform, it is the most important international meeting place for the electronics industry.

Eight Fraunhofer Institutes are providing insights into their latest electronics innovations this year. The range of exhibits extends from sensors to prototyping and pilot manufacturing of microdisplays, as well as micro- and nanosystems.

Other focal points include edge AI or embedded AI, as well as IC design and green ICT.

Exponats

Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS

Chiplet Integration – System, Components, Design Support

more info (chiplet-center.fraunhofer.de)
Fraunhofer IIS, Division EAS (eas.iis.fraunhofer.de)

Fraunhofer IIS, division EAS

Chiplet integration is one of the major trends in the development of electronic systems. We conceptualize and design such systems at system, component and transistor level. While the focus at system level is primarily on innovative architectures, the interfaces between the chiplets and the power supply are particularly important at component level.

Fraunhofer Institute for Integrated Circuits IIS

Chip Size Spektrometer

more info (iis.fraunhofer.de)
Fraunhofer IIS, Research area Smart Sensing and Electronics (iis.fraunhofer.de)

Fraunhofer IIS

Due to the high cost of multispectral sensors with more than six spectral channels, they are not used in many price-sensitive markets. Our nanoSPECTRAL technology is based on optical nanostructures and enables very cost-effective monolithic production of the required optical filters directly in CMOS semiconductor processes, together with the optical sensor elements. The chip-size spectrometer shown at the trade fair already has 320 channels in the visible (VIS) and near-infrared (NIR) wavelength range and is therefore suitable for agricultural applications, analytics, food analysis and medical applications, for example.

Fraunhofer Institute for Ceramic Technologies and Systems IKTS

Antiferroelectric multilayer ceramic capacitors

more info (ikts.fraunhofer.de)

Fraunhofer IKTS

Antiferroelectric multilayer ceramic capacitors (MLCC) are being developed at Fraunhofer IKTS. These capacitors are crucial for the efficiency, power density and reliability of power electronic systems. They offer high capacitance densities, low power losses, excellent voltage and temperature resistance and minimal ageing. Compared to conventional capacitors, they are better suited for modern power converters with wide-band-gap semiconductors. The ceramic MLCCs based on lead lanthanum zirconate titanate (PLZT) have an energy density three times higher than conventional types and are ideal for motor converters. IKTS is working on cost-effective technologies with base metal inner electrodes to further improve the capacity values. The range of services includes material and MLCC development, cost-effective packaging and comprehensive characterization of reliability.

Fraunhofer Institute for Laser Technology ILT

Printed electronics in LPBF components

more info (ilt.fraunhofer.de)

Fraunhofer ILT

The embedding of sensors in additively manufactured components opens up promising new possibilities for the real-time monitoring of components. The milling head presented here was additively manufactured using Laser Powder Bed Fusion (LPBF) at the Fraunhofer Institute for Laser Technology ILT. Strain gauges were printed into the recesses of the milling head jaws using the aerosol jet process, which enable the forces acting on the milling head to be recorded.

Fraunhofer Institute for Manufacturing Engineering and Automation IPA

DryClean CAPE

more info (ipa.fraunhofer.de)

Fraunhofer IPA

Production in the automotive, aerospace and battery cell manufacturing sectors no longer only requires an absolutely clean environment; a particularly low level of humidity is also crucial to the achievable product quality. The technology of the latest mobile cleanroom tent has been adapted for this special occasion. The dry cape consists of two different shells. This creates dryness in combination with freedom from particles.

Fraunhofer Institute for Photonic Microsystems IPMS

Universal Display Data Converter UDDC with WUXGA-OLED-Microdisplay and OLED-Microdisplay with 10.000 dpi in 28 nm Technology

more info (ipms.fraunhofer.de)

Fraunhofer IPMS

Until now, microdisplays could either be used directly, whereby a suitable data source had to be available in the system (e.g. DPI for video displays), or a complex system had to be created with a transmitter chip that implemented the necessary conversion. Depending on the protocol used, this could be very complex. The flexible UDDC electronics platform means that only the video input circuit board needs to be replaced. In the simplest case, only replacing a connector for the respective video interface is necessary. In addition, the overall system is only minimally larger than the microdisplay, so it can be easily integrated into customer applications.

Fraunhofer Institute for Silicon Technology ISIT

Fraunhofer flahship project NeurOSmart: Analog neuromorphic accelerators enabling efficient and smart sensors

more info (neurosmart.fraunhofer.de)

NeurOSmart

NeurOSmart is a Fraunhofer flagship project that aims to revolutionize the way humans and robots collaborate. We achieve this by integrating neuromorphic computing and AI directly into the sensor node, making the sensor more responsive, energy efficient, and easier to integrate. Our goal is to create a seamless human-robot collaboration experience that is intuitive and safe.

Fraunhofer Institute for Reliability and Microintegration IZM

Highly integrated radar modules

more info (izm.fraunhofer.de)

Fraunhofer IZM

The non-contact detection of motion and distances using radar sensors is demonstrated using the example of a Ferris wheel. With an angular resolution of <2° and a detection angle of 120°, the flexibility of the technology is demonstrated. Thanks to miniaturization, this compact radar sensor technology can be used in a variety of applications. It combines a small size, high angular resolution and advanced radiation characteristics using 3D-formed antennas, while using commercially available radar components.